產品說明：
高精準垂直式量角器(θ-θ模式),多元樣品置放容易,可對應大尺寸樣品(400W x 550D x 400H mm)及液體樣品,標準化之繞射峰圖譜自動搜尋比對功能,定性鑑定工作更順暢,當繞射角度偏移時,使用者可非常方便快速地使用自動光學角度調整成正確理論角度。設備精巧設計;節省安裝空間, 一應俱全多重組合的特殊附屬裝置滿足各種應用需求,自動監測功能,確保安全機制,人性化操控介面,使用真輕鬆容易,高動態應用能力,適合各產業需求。
產品規格：
1.X-ray tube
(1) Type Sealed type
(2) Anode Cu
(3) Focus Size 1×10mm (2.0kW) or 2×12mm (2.7kW)
(4) Rating 2.0kW or 2.7kW
2.X-ray generator
(1) Rating 3kW
(2) Control 2nd side detection-1st side control, thyristor method
(3) Stability ±0.01％ in mA and kV against, ±10％deviation of input voltage
(4) Tube voltage setting 20～60kV(1kV step)
(5) Tube current setting 2～80mA(1mA step)
(6) Protection Overload with 1.5～3kW in 0.5kW over-voltage, over-current, poor flow rate of the cooling water
(7) Emergency stop Power down of x-ray power, and goniometer stop
3.Goniometer
(1) Type θ-θ
(2) Goniometer Radius L Type: 275mm (standard)
S Type: 200mm (standard)
(This radius can be adjusted from 200 to 275mm)
(3) Minimum step angle 0.0001゜ (θs and θd)
(4) Scan range -6゜ to + 82゜ (θs)
-6゜ to + 132゜ (θd)
(5) Scanning mode θs and θd couppled
θs and θd independant
(6) Motor drive Stepping motor drive (both θs and θd)
(7) Rapid feeding 500゜/min (θs and θd)
(8) Scanning speed 0.1゜ /min to 50゜/min (θs and θd)
(9) Slit
divergence slit 0.5゜, 1゜, 2゜ and 0.05mm
scattering slit 0.5゜, 1゜, 2゜
receiving slit 0.15mm, 0.3mm
(10) Glancing angle 6゜
(11) Filter Ni (for Cu tube)
(12) Attachment base distance L type: 220mm
(wall to sample center) S type: 85mm
4.Control / Measurement unit
(1) Detector Scintillation counter
Scintillator NaI
Photo multiplier 1 inch head on type
(2) Scaler
Preset time 0.1～1000sec
Digit number 7 digits
(3) HV for detector 500～1200V
(5) PHA Set of base line and window level
5.Case
(1) Dimensions 1120(W)×1049(D)×1790(H)mm
(2) X-ray shield
Observation window Lead-contained transparent acryl plate
8mm thick
Others Iron plate
(3) Coefficient of dose equivalence around the case
Below 2μSv/h (at full X-ray generations)
(4) Door interlock After recognizing the door close, control X-ray generation and the goniometer
(5) Door lock Electromagnetic
6.Data processing system
(1) Control software
Controlled terms X-ray generator
X-ray ON / OFF
Tube voltage and current
Goniometer θs and θd axis
Detector voltage, PHA set, Scaler
(2) Data processing software
File management Conversion from XRD-7000 to ASCII data
Conversion from ASCII data to XRD-7000
Conversion from XD-D1 data* to XRD-7000
Basic data processing Smoothing
Subtraction of back ground
Separation of Kα1 and Kα2
Peak search
Calculation of FWHM and integrated intensity
System error correction
Correction by internal/external standard method
Arithmetic operation among data
Qualitative analysis Automatic search and match using ICDD data base (option)
Quantitative analysis Generation of working curve
Quantitative calculation for unknown sample
Graphic display Vertical display
Horizontal display
Superpose (3D)
Log scale
應用分析：
1.鋼鐵合金/金屬: 結晶構造定性分析,殘留應力分析,奧斯汀鐵 / 殘留分析, 鍍層元素成份比例厚度分析,表面處理後晶型變化分析,鑄造過程中添加 劑效能研究。
2.非鐵合金:
(1)銅及鋅:結晶構造定性分析,薄箔樣品順向度分析,特定區域結晶構造定性分析。
(2)鋁: 鋁與鋁合金結晶構造定性分析, 輾軋過的鋁合金結晶構造定性分析。
(3)機械/汽車/建材:不鏽鋼工具模具/機械零件表面/奧斯汀鐵塗層/機械拉桿, /轉換觸媒, 結晶構造定性分析及殘留應力分析。
3.化學及觸媒業:有機/無機/雜質定性分析, 觸媒樣品結晶化度及結晶粒大小分析。
4.陶瓷/水泥/玻璃業:原料/最終產品於製程加熱過程,對材料結晶系、結晶粒大小、 結晶格子變化研究, 水泥原料最終產品結晶構造定性及定量分 析,玻璃/多層膜定性及順向度分析。
5.醫藥業: 原料/雜質/最終產品結晶多態性構造定性分析, 結晶化度分析, 結晶粒大小分析,專利結晶構造項目鑑定,牙醫齒模材料研究。
6.能源產業:煤礦中碳含量評鑑,石油、天然氣中觸媒添加量晶體結構機轉研究, 礦石中石綿定性及定量分析。
7.電子電機業: 半導體、電子相關元件/板材/多層材產品,相關材料或殘留、腐蝕、黏 附結晶構造定性分析,殘留應力分析,順向度分析。
8.環境:建築物中石綿殘留定性及定量分析,工業廢棄物;爐渣、灰份定性分析。
相關選購/附件：
石墨單光器
ICDD資料庫
樣品座旋轉裝置
石綿樣品分析裝置
自動取樣連續分析裝置
晶片樣品自動定位(R-θ)連續分析裝置
薄膜分析裝置
纖維樣品分析裝置
自動狹縫切換裝置
微區分析裝置(最小直徑0.1mm狹縫)
殘留應力分析裝置
多光纖式平行X光導入系統
樣品座溫度控制裝置
特用樣品架
|
